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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10916437 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Dec. 27, 2018

Methods of forming micropatterns and substrate processing apparatus

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sang-Shin Jang, Suwon-si, KR;

Jong-Min Baek, Seoul, KR;

Hoon-Seok Seo, Suwon-si, KR;

Eui-Bok Lee, Seoul, KR;

Sung-Jin Kang, Seoul, KR;

Vietha Nguyen, Yongin-si, KR;

Deok-Young Jung, Seoul, KR;

Sang-Hoon Ahn, Hwaseong-si, KR;

Hyeok-Sang Oh, Suwon-si, KR;

Woo-Kyung You, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Stephanie P Duclair

Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/11 (2006.01); G03F 7/075 (2006.01); G03F 7/09 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); G03F 7/0752 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/70033 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/02304 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/308 (2013.01); H01L 21/3081 (2013.01); H01L 21/3085 (2013.01); H01L 21/3088 (2013.01); H01J 37/32 (2013.01);
Abstract

Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.

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