The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Jan. 10, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/00 (2006.01); H01F 27/28 (2006.01); H01F 27/22 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 7/14 (2006.01); H02M 3/335 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 27/22 (2013.01); H01F 27/2804 (2013.01); H05K 1/0206 (2013.01); H05K 1/165 (2013.01); H05K 7/1427 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01); H02M 3/33569 (2013.01);
Abstract
A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.