The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Jul. 31, 2020
Applicant:

Ali Tasdighi Far, San Jose, CA (US);

Inventor:

Ali Tasdighi Far, San Jose, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03M 1/66 (2006.01); G06F 7/544 (2006.01); G06N 3/063 (2006.01); H03M 1/68 (2006.01);
U.S. Cl.
CPC ...
G06F 7/5443 (2013.01); G06N 3/063 (2013.01); H03M 1/664 (2013.01); H03M 1/687 (2013.01);
Abstract

Methods of performing mixed-signal current-mode multiply-accumulate (MAC) operations for binarized neural networks in an integrated circuit are described in this disclosure. While digital machine learning circuits are fast, scalable, and programmable, they typically require bleeding-edge deep sub-micron manufacturing, consume high currents, and they reside in the cloud, which can exhibit long latency, and not meet private and safety requirements of some applications. Digital machine learning circuits also tend to be pricy given that machine learning digital chips typically require expensive tooling and wafer fabrication associated with advanced bleeding-edge deep sub-micron semiconductor manufacturing. This disclosure utilizes mixed-signal current mode signal processing for machine learning binarized neural networks (BNN), including Compute-In-Memory (CIM), which can enable on-or-near-device machine learning and or on sensor machine learning chips to operate more privately, more securely, with low power and low latency, asynchronously, and be manufacturable on non-advanced standard sub-micron fabrication (with node portability), that are more mature and rugged with lower costs. An example of enabling features of this disclosure is as follows: to save power in an 'always-on' setting, reduce chip costs, process signals asynchronously, and reduce dynamic power consumption. Current mode signal processing is utilized in combination with CIM (to further reduce dynamic power consumption associated with read/write cycles in and out of memory) for bitwise counting of plurality of logic state '1' of plurality of XOR outputs for MAC arithmetic in BNNs.


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