The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Aug. 14, 2015
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventors:

Ting Zeng, Beijing, CN;

Ming Hu, Beijing, CN;

Xianlin Ding, Beijing, CN;

Qingpu Wang, Beijing, CN;

Guiyu Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); G06F 3/044 (2006.01); C23C 14/00 (2006.01); C23C 14/08 (2006.01); C23C 14/16 (2006.01); C23C 14/35 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); C23C 14/0036 (2013.01); C23C 14/08 (2013.01); C23C 14/165 (2013.01); C23C 14/35 (2013.01); G06F 3/0446 (2019.05); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01);
Abstract

The present disclosure provides a touch substrate. A plurality of first electrodes () spaced apart by a first predetermined distance along a first direction is formed over a substrate (), with adjacent first electrodes () mutually connected via a connection part (). A plurality of second electrodes () spaced apart by a second predetermined distance along a second direction is formed over the substrate (), with adjacent second electrodes () mutually connected via a bridging element (). An insulating layer () is formed between the bridging element () and the connection part (). The insulating layer () is formed by oxidizing a metal element sputtered from a target, which is used to form one or more of the connection part () and the bridging element (), in an ambient with oxygen so as to form a metal oxide layer over one of the connection part () and the bridging element ().


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