The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Feb. 05, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Anuraag Mohan, Fremont, CA (US);

William David French, San Jose, CA (US);

Ubol Udompanyavit, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/04 (2006.01); G01R 33/02 (2006.01); H01L 43/00 (2006.01); H01L 43/08 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
G01R 33/04 (2013.01); G01R 33/0206 (2013.01); H01L 25/04 (2013.01); H01L 43/00 (2013.01); H01L 43/08 (2013.01);
Abstract

An electromagnetic sensing device with a package substrate, a first die mounted on the package substrate, and a second die mounted on the package substrate. The first die includes a first integrated circuit and a first magnetic core formed above the first integrated circuit. The first magnetic core has a first sensing axis parallel to a planar surface of the package substrate. The second die includes a second integrated circuit and a second magnetic core formed above the second integrated circuit. The second magnetic core has a second sensing axis orthogonal to the planar surface of the package substrate.


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