The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10914007 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 09, 2021

Filed:

Mar. 09, 2018
Applicant:

Nps Corporation, Hwaseong-Si, KR;

Inventors:

Dae Seok Song, Hwaseong-Si, KR;

Hyun Jin Park, Suwon-Si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/48 (2006.01); C23C 16/26 (2006.01); C23C 16/46 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/481 (2013.01); C23C 16/26 (2013.01); C23C 16/458 (2013.01); C23C 16/46 (2013.01); H01L 21/67115 (2013.01); H01L 21/6875 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01);
Abstract

The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, the substrate processing method including: introducing a substrate into a chamber; processing the substrate while heating the substrate by using a heat source unit provided in the chamber; and reciprocating at least any one of the substrate and the heat source unit in an extending direction of the substrate. Thus, while the substrate is processed, the temperature of the substrate may be uniformly adjusted, and the efficiency of thermal processing of the substrate may thereby be improved.


Find Patent Forward Citations

Song, Dae. (2021). Method and apparatus for substrate processing (U.S. Patent No. 10914007). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10914007

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