The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Mar. 29, 2013
Applicant:

Sirrus, Inc., Loveland, OH (US);

Inventors:

Bernard M. Malofsky, Bloomfield, CT (US);

Adam G. Malofsky, Loveland, OH (US);

Matthew M. Ellison, Mason, OH (US);

Assignee:

Sirrus, Inc., Loveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/00 (2006.01); B32B 27/28 (2006.01); B32B 29/00 (2006.01); B32B 15/18 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 5/24 (2006.01); B32B 15/04 (2006.01); B32B 27/36 (2006.01); B32B 27/32 (2006.01); B32B 21/04 (2006.01); C09J 5/00 (2006.01); C08F 122/14 (2006.01); C08F 20/36 (2006.01); C08J 3/24 (2006.01); C08F 222/14 (2006.01); C08F 20/28 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 7/06 (2006.01); C08K 7/14 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C08F 216/38 (2006.01); C08F 216/36 (2006.01); C09J 135/02 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); B32B 5/24 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 21/04 (2013.01); B32B 27/283 (2013.01); B32B 27/285 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 29/002 (2013.01); C08F 20/28 (2013.01); C08F 20/36 (2013.01); C08F 122/14 (2013.01); C08F 222/14 (2013.01); C08J 3/242 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 7/06 (2013.01); C08K 7/14 (2013.01); C09J 5/00 (2013.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); B32B 2255/00 (2013.01); B32B 2255/26 (2013.01); B32B 2262/101 (2013.01); B32B 2307/516 (2013.01); B32B 2307/518 (2013.01); B32B 2419/00 (2013.01); B32B 2479/00 (2013.01); B32B 2605/00 (2013.01); C08F 216/36 (2013.01); C08F 216/38 (2013.01); C08F 222/102 (2020.02); C08F 222/145 (2020.02); C08J 2335/02 (2013.01); C08K 2003/2227 (2013.01); C09J 135/02 (2013.01); Y10T 428/31938 (2015.04); Y10T 442/2738 (2015.04);
Abstract

A composite material comprises a reinforcing material carried in a polymer matrix material which is the polymerization product of a polymerizable composition comprising a di-activated vinyl compound, with the proviso that the di-activated vinyl compound is not a cyanoacrylate. The reinforcing materials may be a wide variety of substrates including thermally sensitive materials. Exemplary composites can be molded and cured at ambient temperatures. Also disclosed are laminate materials having layered materials adhered by curing a di-activated vinyl polymerizable composition.


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