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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10913849 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Apr. 11, 2018

Resin composition for semiconductor package, and prepreg and metal clad laminate using the same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Chang Bo Shim, Daejeon, KR;

Hee Yong Shim, Daejeon, KR;

Hyun Sung Min, Daejeon, KR;

Hwa Yeon Moon, Daejeon, KR;

Seung Hyun Song, Daejeon, KR;

Yong Seon Hwang, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08J 5/24 (2006.01); C08L 9/06 (2006.01); C08L 23/20 (2006.01); C08L 83/04 (2006.01); C08K 3/013 (2018.01); C08K 5/08 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); C08J 5/24 (2013.01); C08L 9/06 (2013.01); C08L 23/20 (2013.01); C08L 83/04 (2013.01); C08J 2309/06 (2013.01); C08J 2323/20 (2013.01); C08J 2371/10 (2013.01); C08K 3/013 (2018.01); C08K 5/08 (2013.01); C08L 2203/20 (2013.01);
Abstract

A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.

Find Patent Forward Citations

Shim, Chang. (2021). Resin composition for semiconductor package, and prepreg and metal clad laminate using the same (U.S. Patent No. 10913849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10913849

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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