The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Mar. 02, 2018
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventor:
Kazumasa Oota, Mie, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08G 59/24 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C07D 301/28 (2006.01); C07D 303/27 (2006.01); C07D 303/28 (2006.01); C08G 59/06 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08G 59/40 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C07D 301/28 (2013.01); C07D 303/27 (2013.01); C07D 303/28 (2013.01); C08G 59/063 (2013.01); C08G 59/40 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08L 63/00 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01);
Abstract
The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.