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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10913680 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Jan. 11, 2017

Lead-free glass composition, glass composite material, glass paste, sealing structure, electrical/electronic component and coated component

Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Takashi Naito, Tokyo, JP;

Takuya Aoyagi, Tokyo, JP;

Tatsuya Miyake, Tokyo, JP;

Takeshi Kondo, Tokyo, JP;

Hiroki Kaneko, Tokyo, JP;

Kazutaka Okamoto, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Lauren R Colgan

Int. Cl.
CPC ...
C03C 8/24 (2006.01); C03C 8/16 (2006.01); C03C 8/18 (2006.01); C03C 27/06 (2006.01); C03C 3/12 (2006.01); C03C 8/20 (2006.01); H01J 9/02 (2006.01); H01L 23/10 (2006.01); H01J 11/48 (2012.01); H01J 11/22 (2012.01); C03C 8/02 (2006.01); H01L 23/02 (2006.01); H01L 51/50 (2006.01); H01L 31/0224 (2006.01); H05B 33/04 (2006.01); H01J 9/24 (2006.01); H05B 33/26 (2006.01); C03C 3/21 (2006.01); C03C 14/00 (2006.01); C03C 17/00 (2006.01); C03C 17/04 (2006.01); H01L 51/52 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); C03C 3/12 (2013.01); C03C 3/122 (2013.01); C03C 3/125 (2013.01); C03C 3/21 (2013.01); C03C 8/02 (2013.01); C03C 8/16 (2013.01); C03C 8/18 (2013.01); C03C 8/20 (2013.01); C03C 14/004 (2013.01); C03C 17/007 (2013.01); C03C 17/04 (2013.01); C03C 27/06 (2013.01); H01J 9/02 (2013.01); H01J 9/24 (2013.01); H01J 11/22 (2013.01); H01J 11/48 (2013.01); H01L 23/02 (2013.01); H01L 23/10 (2013.01); H01L 31/0224 (2013.01); H01L 51/50 (2013.01); H05B 33/04 (2013.01); H05B 33/26 (2013.01); C03C 2205/00 (2013.01); C03C 2218/11 (2013.01); H01L 31/022425 (2013.01); H01L 51/5246 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/16152 (2013.01); H03H 9/10 (2013.01);
Abstract

The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships AgO>TeO≥VOand AgO≤2VOwhen calculated in terms of the oxides, and in that the content of TeOis 25-37 mol. %.

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