The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Dec. 08, 2016
Hewlett-packard Development Company, L.p., Houston, TX (US);
Yi Feng, San Diego, CA (US);
Jesiska Tandy, San Diego, CA (US);
Rachael Donovan, San Diego, CA (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
A material set can include a powder bed material, including a polymer powder and a fusing agent. The polymer powder can have a particle size distribution having the following profile: D10 of 30 μm or more, D50 from 50 μm to 65 μm, and D90 of 100?m or less. Other parameters can include a melting point from 100° C. to 300° C., a processing window temperature of 20° C. or more, an energy density absorption of 20% or less, and a melt flow index from 10 cc to 80 cc at 10 minutes. The fusing agent can include an energy absorber capable of absorbing electromagnetic radiation to produce heat.