The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Sep. 07, 2018
Applicant:

Advanced Bionics Ag, Staefa, CH;

Inventors:

Jeryle L. Walter, Valencia, CA (US);

Enrique Gandaria, Santa Clarita, CA (US);

Assignee:

Advanced Bionics AG, Staefa, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); A61N 1/36 (2006.01); H01R 4/62 (2006.01); B23P 23/04 (2006.01); H01R 43/00 (2006.01); H01R 4/02 (2006.01); H01R 12/53 (2011.01); A61N 1/375 (2006.01); H01R 12/51 (2011.01); A61N 1/05 (2006.01); B23K 101/36 (2006.01); B23K 101/32 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36038 (2017.08); A61N 1/375 (2013.01); B23K 1/0008 (2013.01); B23P 23/04 (2013.01); H01R 4/023 (2013.01); H01R 4/62 (2013.01); H01R 12/53 (2013.01); H01R 43/00 (2013.01); A61N 1/0541 (2013.01); A61N 1/3752 (2013.01); B23K 2101/32 (2018.08); B23K 2101/36 (2018.08); H01R 12/51 (2013.01);
Abstract

An exemplary connection joint includes a wire constructed from a first conductive material having a first melting point and a pad constructed from a second conductive material different from the first conductive material and having a second melting point lower than the first melting point. The connection joint further includes a groove within the pad that partially surrounds the wire and a fixative covering the wire and the pad so as to fix the wire in place within the groove. The groove is formed by a displacement of the second conductive material that occurs when the wire is in contact with the pad at a contact area of the pad that is heated to a temperature between the first and second melting points so as to reflow the second conductive material from which the pad is constructed without reflowing the first conductive material from which the wire is constructed.


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