The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jan. 13, 2017
Lg Innotek Co., Ltd., Seoul, KR;
Jung Ho Hwang, Seoul, KR;
Han Su Lee, Seoul, KR;
Dae Young Choi, Seoul, KR;
Soon Gyu Kwon, Seoul, KR;
Dong Hun Jeong, Seoul, KR;
In Ho Jeong, Seoul, KR;
Kil Dong Son, Seoul, KR;
Sang Hwa Kim, Seoul, KR;
Sang Young Lee, Seoul, KR;
Jae Hoon Jeon, Seoul, KR;
Jin Hak Lee, Seoul, KR;
Yun Mi Bae, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.