The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jan. 14, 2019
Applicant:
Stanley Electric Co., Ltd., Tokyo, JP;
Inventors:
Akihiko Hanya, Tokyo, JP;
Tsukasa Imura, Tokyo, JP;
Assignee:
STANLEY ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/12 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); B22F 7/06 (2006.01); H05K 3/30 (2006.01); H05K 1/09 (2006.01); B22F 1/00 (2006.01); B22F 3/105 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B22F 7/062 (2013.01); B22F 7/064 (2013.01); H05K 1/092 (2013.01); H05K 3/1283 (2013.01); H05K 3/303 (2013.01); B22F 1/0014 (2013.01); B22F 3/105 (2013.01); H05K 2203/1131 (2013.01);
Abstract
Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.