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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10912188 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Mar. 21, 2017

High-frequency component

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Norio Sakai, Kyoto, JP;

Tetsuya Kanagawa, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Peame & Gordon LLP

Primary Examiner:

Ronald Hinson

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H05K 1/02 (2006.01); H01F 27/40 (2006.01); H01F 17/04 (2006.01); H05K 1/11 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/2823 (2013.01); H01F 27/40 (2013.01); H05K 1/113 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15173 (2013.01); H05K 3/3452 (2013.01); H05K 2201/049 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface of the resin layer and lower end surfaces thereof are exposed from a lower surface of the resin layer. The electronic component has a first outer electrode provided at a position superposed with the upper end surface of the first metal pin in plan view and is connected to the first metal pin, and a second outer electrode provided at a position superposed with the upper end surface of the second metal pin in plan view and is connected to the second metal pin.

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