The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Nov. 28, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Shota Sato, Tokyo, JP;
Tsuneo Hamaguchi, Tokyo, JP;
Yuji Shirakata, Tokyo, JP;
Kenta Fujii, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.