The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Mar. 12, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Markus Pindl, Tegernheim, DE;

Bernhard Stich, Nittendorf, DE;

Andreas Wojcik, Regensburg, DE;

Assignee:

OSRAM OLED GMBH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01S 5/02208 (2021.01); H01S 5/022 (2021.01); H01S 5/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02208 (2013.01); H01S 5/02228 (2013.01); H01S 5/0612 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.


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