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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10910705 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Jun. 20, 2019

Antenna in package device having substrate stack

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Vikas Gupta, Dallas, TX (US);

Athena Lin, Dallas, TX (US);

Juan Alejandro Herbsommer, Allen, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Ronald O. Neerings

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Graham P Smith

Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H04B 1/40 (2015.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/162 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/24 (2013.01); H04B 1/40 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/19033 (2013.01);
Abstract

An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

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