The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Apr. 03, 2017
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jung Woo Lee, Daejeon, KR;

Hyun Jee Yoo, Daejeon, KR;

Hyun Suk Kim, Daejeon, KR;

Jung Ok Moon, Daejeon, KR;

Se Woo Yang, Daejeon, KR;

Assignee:

LG CHEM LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); C09K 3/10 (2006.01); C09J 7/28 (2018.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); C09J 7/28 (2018.01); C09K 3/10 (2013.01); H01L 51/0096 (2013.01); C09J 2203/326 (2013.01); C09J 2301/208 (2020.08); C09J 2301/302 (2020.08); H01L 2251/558 (2013.01);
Abstract

The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.


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