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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10910540 B1

PDFFull Text
Expired
Date of Patent:
Feb. 02, 2021

Filed:

Mar. 28, 2018

Solid state light emitter die having a heat spreader between a plurality lead frame

Applicant:

Signify Holding B.v., Eindhoven, NL;

Inventors:

Boudewijn Jacobs, Eindhoven, NL;

Willem Dirk Van Driel, Eindhoven, NL;

Cornelis Van Der Marel, Eindhoven, NL;

Assignee:

SIGNIFY HOLDING B.V., Eindhoven, NL;

Attorney:

Daniel J. Piotrowski

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/10 (2006.01); H01L 33/00 (2010.01); H01L 31/0232 (2014.01); H01L 23/495 (2006.01); H01L 21/00 (2006.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/641 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48245 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A solid state light emitter package (), a lamp, a luminaire and a method of manufacturing the solid state light emitter package are provided. The solid state light emitter package comprising a solid state light emitter die (), a first and second lead frame (), an electrical insulating material (), a thermal element () and a bridging element (). The first and second lead frame are electrically isolated from each other and provide power to said die. Said die is at least partially provided on the first lead frame. The thermal element is in between the first and second lead frame and is electrically isolated by the electrical insulating material from said lead frames. The thermal element is at least one of a heat absorber or a heat spreader. The bridging element bridges the electrical insulating material and the thermal element and provides an electrical connection between said die and the second lead frame.

Find Patent Forward Citations

Jacobs, Boudewijn. (2021). Solid state light emitter die having a heat spreader between a plurality lead frame (U.S. Patent No. 10910540). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10910540

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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