The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Oct. 29, 2019
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Kenji Ozeki, Tokushima, JP;
Chinami Nakai, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 51/56 (2006.01); H01L 25/13 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 23/3107 (2013.01); H01L 25/13 (2013.01); H01L 33/56 (2013.01); H01L 51/56 (2013.01); H01L 2933/005 (2013.01);
Abstract
A method of manufacturing a light-emitting device includes providing a package having an upper surface and defining a recess, the recess having an opening at the upper surface. A light-emitting element is placed on a bottom surface of the recess of the package, and the recess of the package is filled with an uncured sealing member containing a silicone resin. The package is held in a liquid in a state in which the uncured sealing member is filled in the recess of the package, and the uncured sealing member is cured by heating the package in which the uncured sealing member is filled in the recess.