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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10910500 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Feb. 13, 2018

Load sensing devices, packages, and systems

Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Mohammad Abbasi Gavarti, Milan, IT;

Daniele Caltabiano, Agrate Brianza, IT;

Marco Omar Ghidoni, Melzo, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Nilufa Rahim

Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 29/16 (2006.01); H01L 23/10 (2006.01); H01L 29/06 (2006.01); G01L 1/18 (2006.01); H01L 23/047 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); G01L 1/18 (2013.01); H01L 23/047 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 29/0657 (2013.01); H01L 29/16 (2013.01); H01L 24/33 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29117 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01032 (2013.01);
Abstract

In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

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