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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10910450 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Jun. 04, 2019

Chip on film package and display device

Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventor:

Ying-Neng Huang, Taichung, TW;

Assignee:

Novatek Microelectronics Corp., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Nikolay K Yushin

Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 51/00 (2006.01); H01L 27/32 (2006.01); H05K 1/03 (2006.01); G06K 9/00 (2006.01); G02F 1/1333 (2006.01); G06F 3/041 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3244 (2013.01); G02F 1/133305 (2013.01); G06F 3/0412 (2013.01); G06K 9/00013 (2013.01); H01L 51/0097 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01);
Abstract

A chip on film package structure including a flexible film and a chip is provided. The flexible film includes a main body and a first wing body. The main body includes a main bonding portion configured to be bonded to a first substrate. The first wing body includes a first extending part and a first bent part. The first extending part is extended from a side of the main body. The first bent part is configured to be bent to a second substrate and having a first wing bonding portion. The first wing bonding portion is configured to be bonded to the second substrate. The first substrate and the second substrate are stacked on top of each other. The chip mounted on and electrically connected to the main body. A display device is also provided.

Find Patent Forward Citations

Huang, Ying-Neng. (2021). Chip on film package and display device (U.S. Patent No. 10910450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10910450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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