The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Jun. 05, 2019
Applicant:

Toppan Printing Co., Ltd., Taito-ku, JP;

Inventors:

Kazuto Yamamoto, Taito-ku, JP;

Yo Sakata, Taito-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G02B 5/10 (2006.01); H04N 9/07 (2006.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14629 (2013.01); G02B 5/10 (2013.01); H01L 27/1464 (2013.01); H04N 5/369 (2013.01); H04N 9/07 (2013.01); H01L 27/1463 (2013.01); H01L 27/14627 (2013.01); H01L 27/14643 (2013.01);
Abstract

A solid-state image sensor including a semiconductor layer having a light incident side, a support substrate positioned on an opposite side of the light incident side of the semiconductor layer, photoelectric conversion elements formed two-dimensionally in the semiconductor layer, light reflection structures formed on a surface of the support substrate which faces toward the semiconductor layer, and positioned such that the light reflection structures face the photoelectric conversion elements, respectively, and an interlayer insulating layer formed between adjacent ones of the light reflection structures. The light reflection structures include a light transmission layer and a reflective metal that covers a surface of the light transmission layer opposite to a surface facing the semiconductor layer, and the reflective metal has a concave curved surface facing the photoelectric conversion elements.


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