The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
May. 22, 2015
Applicant:
Hiphoton Co., Ltd., Hsinchu, TW;
Inventors:
Chen-Fu Chu, Hsinchu, TW;
Chen-Hsien Chu, Hsinchu, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 33/44 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/97 (2013.01); H01L 33/50 (2013.01); H01L 33/44 (2013.01); H01L 33/504 (2013.01); H01L 33/54 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
A structure of a semiconductor array comprises multiple semiconductor units, an isolation layer and a decomposed or buffer unit. Multiple semiconductor units combined the semiconductor array. The isolation layer coated each semiconductor unit. The decomposed or buffer unit coated the isolation layer and filled between each semiconductor unit to enhance structure of the semiconductor units. Wherein, the isolation layer protected by edge of the semiconductor units and the decomposed or buffer unit.