The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Feb. 09, 2018
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventor:
Chun-Liang Chen, Zhubei, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/562 (2013.01); H01L 24/48 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05076 (2013.01); H01L 2224/05085 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/301 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A pad structure is formed on an IC die and includes a first conductive layer, a dielectric layer, a second conductive layer and a passivation layer. The first conductive layer is formed on an upper surface of the IC die and having a hollow portion. The dielectric layer covers the first conductive layer. The second conductive layer is formed on the dielectric layer and electrically connected to the first conductive layer. The passivation layer covers the second conductive layer and has an opening exposing the second conductive layer for receiving a bonding wire.