The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Feb. 28, 2017
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Tatsuhiko Asai, Hino, JP;
Katsumi Taniguchi, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/049 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 23/049 (2013.01); H01L 23/10 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A semiconductor device has a configuration in which a stacked assembly and a resin case are combined. The stacked assembly includes a semiconductor element, a stacked substrate on which the semiconductor element is mounted, and a metal substrate on which the stacked substrate is mounted. In the resin case, a notch groove is provided at a corner portion for reducing a stress. At least one of a width and a length of the notch groove is 2 mm or more.