The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Feb. 20, 2017
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Soichiro Umeda, Hanno, JP;
Yuji Morinaga, Hanno, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Hanno, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/482 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4828 (2013.01); H01L 23/31 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49555 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
An electronic device has a sealing part, an electronic elementprovided in the sealing partand a connection bodyhaving a head partconnected to a front surface of the electronic elementvia a conductive adhesive. The head parthas a second projection protrudingtoward the electronic elementand a first projectionprotruding from the second projectiontoward the electronic element