The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
May. 06, 2019
Comchip Technology Co., Ltd., New Taipei, TW;
Chien-Chih Lai, New Taipei, TW;
Hung-Wen Lin, New Taipei, TW;
COMCHIP TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
A method of manufacturing chip package is disclosed. The method includes providing a wafer having a first surface and a second surface, in which the wafer includes conductive bumps disposed on the first surface; thinning the wafer from the second surface toward the first surface; dicing the wafer to form chips, in which each chip has a third surface and a fourth surface, and at least one of the conductive bumps is disposed on the third surface; disposing the chips on a substrate, such that the conductive bumps are disposed between the substrate and the third surface, in which any two adjacent of the chips are spaced apart by a gap ranging from 50 μm to 140 μm; forming an insulating layer filling the gaps and covering the chips; and dicing the insulating layer along each gap to form a plurality of chip packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile