The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Nov. 04, 2019
Applicant:
Qromis, Inc., Santa Clara, CA (US);
Inventors:
Vladimir Odnoblyudov, Danville, CA (US);
Cem Basceri, Los Gatos, CA (US);
Shari Farrens, Boise, ID (US);
Assignee:
QROMIS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/48 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/06 (2006.01); B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); B32B 9/005 (2013.01); H01L 21/481 (2013.01); H01L 21/4871 (2013.01); H01L 29/0649 (2013.01); B32B 2307/704 (2013.01); B32B 2309/105 (2013.01); H01L 21/02164 (2013.01); H01L 21/02238 (2013.01); H01L 21/02255 (2013.01); H01L 21/31111 (2013.01);
Abstract
A substrate includes a polycrystalline ceramic core; a first adhesion layer encapsulating the polycrystalline ceramic core; a conductive layer encapsulating the first adhesion layer; a second adhesion layer encapsulating the conductive layer; a barrier layer encapsulating the second adhesion layer, and a bonding layer coupled to the barrier layer, and a substantially single crystalline silicon layer coupled to the bonding layer.