The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Nov. 08, 2017
Applicant:

Tel Fsi, Inc., Chaska, MN (US);

Inventors:

William P. Inhofer, Plymouth, MN (US);

Sean Moore, Maple Grove, MN (US);

Lance Van Elsen, Oakdale, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); B08B 5/02 (2006.01); B08B 3/02 (2006.01); B08B 3/10 (2006.01); H01L 21/67 (2006.01); H02N 15/00 (2006.01); C23C 16/46 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68764 (2013.01); B08B 3/02 (2013.01); B08B 3/10 (2013.01); B08B 5/02 (2013.01); C23C 16/46 (2013.01); H01L 21/67051 (2013.01); H01L 21/67748 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); H02N 15/00 (2013.01);
Abstract

Cleaning systems and methods for semiconductor fabrication use rotatable and optionally translatable chuck assemblies that incorporate magnetic levitation and rotation functionality to cause chuck rotation. The rotating chuck components do not physically contact other chuck components when levitated and rotating. This eliminates corresponding components whose friction or lubricants might generate contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments. By avoiding the use of lubricants for this rotating interface, process chambers can be evacuated and/or vented up to higher pressures much faster. This significantly reduces cycle time for cryogenic treatments.


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