The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Feb. 01, 2019
Applicant:

Techest, Co., Ltd., Anseong-si, KR;

Inventors:

Yong Kyun Lim, Suwon-si, KR;

Cheol Won Jang, Hwaseong-si, KR;

Min Jin Han, Hwaseong-si, KR;

Jae Geon Kim, Osan-si, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/46 (2006.01); H01J 37/32 (2006.01); G05B 11/42 (2006.01); G05D 23/19 (2006.01); G05D 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); C23C 16/463 (2013.01); G05B 11/42 (2013.01); G05D 7/0635 (2013.01); G05D 23/1905 (2013.01); H01J 37/32522 (2013.01); H01L 21/67017 (2013.01); H01L 21/67098 (2013.01); H01L 21/67109 (2013.01); H01L 21/67276 (2013.01); H01J 37/32724 (2013.01);
Abstract

A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.


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