The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Apr. 04, 2017
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
Autonetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Misato Kusakari, Osaka, JP;
Tetsuya Kuwabara, Osaka, JP;
Yoshihiro Nakai, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Yasuyuki Otsuka, Yokkaichi, JP;
Hayato Ooi, Yokkaichi, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Abstract
An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 μm long and a long side of 50 μm long is taken from a surface-layer region extending by up to 30 μm in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 μm.