The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Apr. 22, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Taesung Lee, Hwaseong-si, KR;
Junghwan Choi, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 12/02 (2006.01); G06F 12/0866 (2016.01);
U.S. Cl.
CPC ...
G06F 3/0656 (2013.01); G06F 3/0659 (2013.01); G06F 3/0688 (2013.01); G06F 12/0238 (2013.01); G06F 12/0246 (2013.01); G06F 12/0866 (2013.01);
Abstract
A semiconductor memory module includes data buffers that exchange first data signals with an external device, nonvolatile memory devices that are respectively connected to the data buffers through data lines, and a controller connected to the data lines. The controller receives an address, a command, and a control signal from the external device, and depending on the address, the command, and the control signal, the controller controls the data buffers through first control lines and controls the nonvolatile memory devices through second control lines.