The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Sep. 26, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01T 1/08 (2006.01); G01R 31/28 (2006.01); H01L 23/00 (2006.01); G01T 1/16 (2006.01); G01K 11/12 (2006.01); G01K 1/02 (2006.01); G01N 21/78 (2006.01); G01R 31/44 (2020.01); G01N 21/77 (2006.01); G01N 21/81 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2881 (2013.01); G01K 1/02 (2013.01); G01K 11/12 (2013.01); G01N 21/78 (2013.01); G01R 31/2874 (2013.01); G01R 31/2879 (2013.01); G01R 31/44 (2013.01); G01T 1/08 (2013.01); G01T 1/16 (2013.01); H01L 23/564 (2013.01); G01N 21/81 (2013.01); G01N 2021/7796 (2013.01); H01L 25/0655 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.