The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jan. 27, 2017
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Masamichi Iino, Tokyo, JP;
Shigeto Hirai, Tokyo, JP;
Taiki Asahara, Tokyo, JP;
Takafumi Ogino, Tokyo, JP;
Akira Kirita, Tokyo, JP;
Akihiro Toda, Tokyo, JP;
Hideyuki Sakata, Tokyo, JP;
Yutaka Tanaka, Tokyo, JP;
Setsuo Tokunaga, Tokyo, JP;
Takashi Nakahara, Tokyo, JP;
Takanori Okazaki, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A flow damper including a cylindrical vortex chamber, a small flow-rate pipe connected to a peripheral plate of the vortex chamber along a tangential direction, a large flow-rate pipe connected to the peripheral plate with a predetermined angle with respect to the small flow-rate pipe, an outlet pipe connected to an outlet formed in a central part of the vortex chamber, and a pressure equalization pipe with respective ends being connected to the peripheral plate on opposite sides of the outlet and at positions closer to a connection portion between the small flow-rate pipe and the large flow-rate pipe than positions facing each other, putting the outlet therebetween. The pressure equalization pipe is arranged with at least a part thereof is located at a higher position than a top plate of the vortex chamber, and an outgassing hole is provided at an uppermost part of the pressure equalization pipe.