The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Jun. 26, 2013
Applicants:

Uacj Corporation, Tokyo, JP;

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Tomoyuki Kudo, Tokyo, JP;

Makoto Saga, Tokyo, JP;

Assignee:

UACJ CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 21/08 (2006.01); C22F 1/05 (2006.01); C22F 1/043 (2006.01); C22F 1/00 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); C22C 21/02 (2006.01); C22C 21/04 (2006.01); C22F 1/047 (2006.01);
U.S. Cl.
CPC ...
C22F 1/043 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/04 (2013.01); C22C 21/08 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/047 (2013.01); C22F 1/05 (2013.01);
Abstract

Provided is an aluminum alloy plate for blow molding comprising: 0.3% by mass or more and 1.8% by mass or less of Mg; 0.6% by mass or more and 1.6% by mass or less of Si; and 0.2% by mass or more and 1.2% by mass or less of Mn; wherein, in at least one surface of the aluminum alloy plate for blow molding, X and Y satisfy the following relations: 0.10≤X, and, Y≥−8.0X+10.8; wherein X represents the ratio of regions whose valley depth in a roughness curve is 0.3 μm or more; and Y represents the yield stress upon deformation of the aluminum alloy plate for blow molding under predetermined conditions.


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