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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10907076 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Nov. 24, 2016

Reactive two-component adhesive system in the form of a film and bonding method

Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Sebastian Dietze, Hamburg, DE;

Arne Koops, Neu-Lankau, DE;

Gero Maatz, Düsseldorf, DE;

Uwe Schümann, Pinneberg, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:

Norris McLaughlin, P.A.

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Cynthia L Schaller

Int. Cl.
CPC ...
C09J 5/04 (2006.01); C09J 5/00 (2006.01); B32B 15/04 (2006.01); B32B 29/00 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 15/12 (2006.01); C09J 7/28 (2018.01); C09J 7/20 (2018.01); C09J 7/30 (2018.01);
U.S. Cl.
CPC ...
C09J 5/04 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/12 (2013.01); B32B 15/20 (2013.01); B32B 29/005 (2013.01); C09J 5/00 (2013.01); C09J 7/20 (2018.01); C09J 7/28 (2018.01); C09J 7/30 (2018.01); B32B 2250/03 (2013.01); B32B 2255/12 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2405/00 (2013.01); C09J 2301/416 (2020.08); C09J 2400/123 (2013.01); C09J 2400/163 (2013.01);
Abstract

Method of adhesively bonding two surfaces by means of a reactive adhesive film system comprising at least two adhesive films (F1 and F2), each comprising at least one reactive component (R1 and R2), adhesive bonding being effected by a reaction which requires the presence of both reactive components (R1 and R2), wherein, prior to adhesive bonding, a separating layer (T) which is impermeable to the reactive components is provided between the adhesive films which are to be brought into contact with one another for the reaction, and the separating layer (T) is removed at least in part by means of a laser in order to effect bonding, so that the adhesive films (F1 and F2) come into direct contact with one another and the reaction begins in the presence of both reactive components (R1 and R2), and reactive adhesive film system for use in this method.

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