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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10907009 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Feb. 11, 2018

Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates

Applicant:

Jiangnan University, Jiangsu, CN;

Inventors:

Ren Liu, Jiangsu, CN;

Zhiquan Li, Jiangsu, CN;

Liping Zhang, Jiangsu, CN;

Yangyang Xu, Jiangsu, CN;

Assignee:

JIANGNAN UNIVERSITY, Jiangsu, unknown;

Attorneys:

Enshan Hong

VLP Law Group LLP

Primary Examiner:

Rachel Kahn

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08G 59/17 (2006.01); C08G 59/42 (2006.01); C08G 59/14 (2006.01); C09D 163/10 (2006.01); C08G 59/62 (2006.01); G03F 7/031 (2006.01); C09J 163/10 (2006.01);
U.S. Cl.
CPC ...
C08G 59/1466 (2013.01); C08G 59/145 (2013.01); C08G 59/4215 (2013.01); C08G 59/62 (2013.01); C09D 163/10 (2013.01); C09J 163/10 (2013.01); G03F 7/031 (2013.01);
Abstract

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

Find Patent Forward Citations

Liu, Ren. (2021). Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates (U.S. Patent No. 10907009). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10907009

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