The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Oct. 23, 2017
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yasutaka Sugimoto, Nagaokakyo, JP;
Kazuhiro Kaneko, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/195 (2006.01); H01B 3/12 (2006.01); C04B 35/16 (2006.01); H05K 1/03 (2006.01); B32B 18/00 (2006.01); C04B 35/14 (2006.01); C03C 3/064 (2006.01); C03C 3/089 (2006.01); C03C 14/00 (2006.01); C04B 35/63 (2006.01); C04B 35/64 (2006.01); H03H 7/01 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C04B 35/195 (2013.01); B32B 18/00 (2013.01); C03C 3/064 (2013.01); C03C 3/089 (2013.01); C03C 14/004 (2013.01); C04B 35/14 (2013.01); C04B 35/16 (2013.01); C04B 35/6303 (2013.01); C04B 35/64 (2013.01); H01B 3/12 (2013.01); H03H 7/0138 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/113 (2013.01); H05K 3/4664 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3436 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/36 (2013.01); C04B 2235/365 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2237/341 (2013.01); C04B 2237/68 (2013.01); H03H 7/0115 (2013.01); H05K 3/4605 (2013.01);
Abstract
A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of AlO, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of BO, and 0.1 to less than 3 parts by weight of LiO. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.