The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Aug. 16, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Takayuki Teshima, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); H01L 21/3205 (2006.01); H01L 27/00 (2006.01); H01L 23/52 (2006.01); B41J 2/16 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/045 (2013.01); B41J 2/16 (2013.01); H01L 21/3205 (2013.01); H01L 23/52 (2013.01); H01L 27/00 (2013.01); B41J 2202/13 (2013.01);
Abstract

A liquid ejection head includes, a multilayer wiring layer having a plurality of wiring layers laid one on the other and an insulating layer enveloping the plurality of wiring layers, an ejection orifice forming member arranged on one of the oppositely disposed surfaces of the multilayer wiring layer and having an ejection orifice formed therethrough to eject liquid and a through-hole electrode arranged in a through hole running through the multilayer wiring layer between the one and the other surfaces of the multilayer wiring layer. The plurality of wiring layers includes a first wiring layer having a surface located closest to the ejection orifice forming member and the through-hole electrode is held in contact with at least one surface of the plurality of wiring layers different from the surface of the first wiring layer and is electrically connected to the plurality of wiring layers.


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