The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jun. 25, 2019
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Masaya Uyama, Kawasaki, JP;
Takuya Hatsui, Tokyo, JP;
Souta Takeuchi, Fujisawa, JP;
Masataka Kato, Hiratsuka, JP;
Toru Nakakubo, Kawasaki, JP;
Tomohiro Takahashi, Yokohama, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/14201 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); B41J 2002/14491 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/48453 (2013.01);
Abstract
A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.