The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Apr. 17, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Tae-Yeong Kim, Yongin-si, KR;
Jun-Hyung Kim, Yongin-si, KR;
Hoe-Chul Kim, Seoul, KR;
Hoon-Joo Na, Seoul, KR;
Kwang-Jin Moon, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.