The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Sep. 04, 2019
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Sungwoo Eo, Suwon-si, KR;

Hunkyo Kim, Cheonan-si, KR;

Byoungyul Shim, Asan-si, KR;

Jusuk Oh, Cheonan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/08 (2006.01); B29C 51/42 (2006.01); B29C 51/44 (2006.01); B29C 51/20 (2006.01); B29C 51/46 (2006.01); B29C 53/04 (2006.01); B29K 69/00 (2006.01); C03B 23/025 (2006.01); B29C 33/16 (2006.01); B29C 33/32 (2006.01); C03B 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/08 (2013.01); B29C 51/20 (2013.01); B29C 51/42 (2013.01); B29C 51/445 (2013.01); B29C 51/46 (2013.01); B29C 53/04 (2013.01); B29C 33/16 (2013.01); B29C 33/32 (2013.01); B29K 2069/00 (2013.01); C03B 23/0026 (2013.01); C03B 23/025 (2013.01); C03B 23/0252 (2013.01); C03B 23/0256 (2013.01); C03B 23/0258 (2013.01);
Abstract

Provided is a method of thermoforming a molding material to have a bent portion and a flat portion extending from the bent portion. The method includes: placing the molding material on a bending mold, the bending mold having a curved surface; and forming the bent portion of the molding material by heating a portion of the molding material at least to a fluidization temperature such that the portion of the molding material bends due to the weight of the flat portion of the molding material to form the bent portion according to a shape of the bending mold.


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