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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10906211 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Dec. 21, 2016

Mold-releasable surfacing materials for composite parts

Applicant:

Cytec Industries Inc., Princeton, NJ (US);

Inventors:

Junjie Jeffrey Sang, Newark, DE (US);

Dalip Kumar Kohli, Churchville, MD (US);

Assignee:

Cytec Industries Inc., Woodland Park, NJ (US);

Attorney:
Primary Examiner:

Chinessa T Golden

Int. Cl.
CPC ...
B29C 33/56 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/02 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/38 (2006.01); B32B 27/18 (2006.01); B32B 15/08 (2006.01); B32B 5/22 (2006.01); B32B 5/24 (2006.01); B29C 70/08 (2006.01);
U.S. Cl.
CPC ...
B29C 33/56 (2013.01); B32B 5/024 (2013.01); B32B 5/22 (2013.01); B32B 5/24 (2013.01); B32B 5/26 (2013.01); B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/283 (2013.01); B32B 27/304 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); B29C 70/088 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2264/02 (2013.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/108 (2013.01); B32B 2307/202 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/71 (2013.01); B32B 2307/748 (2013.01);
Abstract

A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

Find Patent Forward Citations

Sang, Junjie. (2021). Mold-releasable surfacing materials for composite parts (U.S. Patent No. 10906211). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10906211

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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