The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Mar. 06, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Yasumitsu Omi, Kariya, JP;

Takashi Yamanaka, Kariya, JP;

Yoshiki Kato, Kariya, JP;

Takeshi Yoshinori, Kariya, JP;

Masayuki Takeuchi, Kariya, JP;

Koji Miura, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); B23P 15/26 (2006.01); H05K 7/20 (2006.01); F25B 1/00 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); F25B 1/00 (2013.01); F28D 15/02 (2013.01); F28D 15/0283 (2013.01); H05K 7/20 (2013.01); B23P 2700/09 (2013.01);
Abstract

A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.


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