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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10906132 B1

PDFFull Text
Date of Patent:
Feb. 02, 2021

Filed:

Mar. 31, 2017

Scan strategies for efficient utilization of laser arrays in direct metal laser melting (dmlm)

Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

William Thomas Carter, Galway, NY (US);

Jason Harris Karp, Niskayuna, NY (US);

Justin John Gambone, Jr., Watervliet, NY (US);

Lang Yuan, Niskayuna, NY (US);

David Charles Bogdan, Jr., Charlton, NY (US);

Victor Petrovish Ostroverkhov, Ballston Lake, NY (US);

Marshall Gordon Jones, Scotia, NY (US);

Michael Evans Graham, Slingerlands, NY (US);

Kevin George Harding, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:

Robert McCarthy

Primary Examiner:

Hung D Nguyen

Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/082 (2014.01); B23K 26/08 (2014.01); B23K 26/144 (2014.01); B23K 26/12 (2014.01); B23K 26/06 (2014.01); B23K 103/02 (2006.01); B23K 103/10 (2006.01); B23K 103/14 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B23K 26/0006 (2013.01); B23K 26/0604 (2013.01); B23K 26/082 (2015.10); B23K 26/0823 (2013.01); B23K 26/123 (2013.01); B23K 26/127 (2013.01); B23K 26/144 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B23K 2103/02 (2018.08); B23K 2103/10 (2018.08); B23K 2103/14 (2018.08); B23K 2103/26 (2018.08); Y02P 10/25 (2015.11);
Abstract

An additive manufacturing system configured to manufacture a component including scan strategies for efficient utilization of one or more laser arrays. The additive manufacturing system includes at least one laser device, each configured as a laser array, and a build platform. Each laser device is configured to generate a plurality of laser beams. The component is disposed on the build platform. The at least one laser device is configured to sweep across the component and the build platform in at least one of a radial direction, a circumferential direction or a modified zig-zag pattern and simultaneously operate the one or more of the plurality of individually operable laser beams corresponding to a pattern of the layer of a build to generate successive layers of a melted powdered material on the component and the build platform corresponding to the pattern of the layer of the build. A method of manufacturing a component with the additive manufacturing system is also disclosed.

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