The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Aug. 05, 2015
Applicant:

Riken Technos Corporation, Tokyo, JP;

Inventors:

Taketo Hashimoto, Tokyo, JP;

Hiroyuki Tomomatsu, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/18 (2006.01); B23K 26/38 (2014.01); B32B 37/06 (2006.01); B32B 38/00 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B23K 26/18 (2013.01); B23K 26/38 (2013.01); B32B 37/06 (2013.01); B32B 38/0004 (2013.01); B32B 37/26 (2013.01); B32B 38/10 (2013.01); B32B 2307/402 (2013.01); B32B 2310/0843 (2013.01);
Abstract

Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B') a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.


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