The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Apr. 03, 2018
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Ga Young Woo, Gyeongsangbuk-do, KR;
Young Su Son, Chungcheongbuk-Do, KR;
Byeong Geon Kim, Gyeonggi-do, KR;
Assignee:
LG Chem, Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); H01L 23/13 (2013.01); H01L 23/49833 (2013.01); H05K 1/111 (2013.01); H05K 1/183 (2013.01); H05K 3/107 (2013.01); H05K 3/3442 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10984 (2013.01);
Abstract
The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.