The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
May. 24, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/188 (2013.01); H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/0014 (2013.01); H05K 3/4617 (2013.01); H05K 3/462 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1453 (2013.01);
Abstract
In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.
Morita, Takaaki. (2021). Printed wiring board and method for manufacturing the same (U.S. Patent No. 10905013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10905013
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile